infineon IGBT安装原理

infineon IGBT安装原理
Application Note

Datum: 19-12-2005 Seite 1
AN-Nummer: AN-2006-02 Abteilung: AIM PMD ID AE

Application of screen print templates
to paste thermal grease within IGBT
modules

Introduction
When operating semiconductor modules the power losses need to be
transferred to a heatsink in order not to exceed the maximum junction
temperature of the components.
Thermal compound is normally used to aid thermal contact between
module and heat sink. Both unevenness of the base plate and surface
roughness of the heat sink are thus compensated.
The following introduces the screen print process to apply thermal
compounds.


Screen print template
Contrar