器件名称: MSOP
功能描述: Small Outline Packages
文件大小: 101.77KB 共2页
简 介:TSSOP and MSOP
Small Outline Packages
Wide range of body sizes 8 to 56 lead counts Thermally enhanced versions available (TSSOP-ep and MSOP-ep)
FEATURES
TSSOP Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm Lead Count: 8L to 56L Lead Pitch: 0.50mm & 0.65mm Package Height: 1.20mm max. JEDEC standard compliant (MO-153) Lead-free (Pb-free) and Green Thermal Enhancements: ep (exposed pad) MSOP Body Size: 3 x 3mm Lead Count: 8L & 10L Lead Pitch: 0.65mm (8L) and 0.50mm (10L) JEDEC standard compliant Lead-free (Pb-free) and Green Thermal enhancements: ep (exposed pad)
DESCRIPTION
STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP. STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile. TSSOP is a leadframe based, plastic encapsulated package with gull wing shaped leads on two sides with lead count ranging from 8 to 56 leads. The ultra thin TSSOP is made possible by optimal wire looping control during the wire bonding process as well as optimal package warpage control during the molding process. TSSOP is designed to fill the niche of low pin count devices where low profile and small footprint are key design considerations. The TSSOP features 0.5 and 0.65mm lead pitch, and is ideal for low pin count analog and mixed signal devices in handheld applications such as PDAs and mobile / cellular phones. Taking the reliability of Small Outline Packages (SOP) one ste……
