器件名称: QFP-EP
功能描述: Exposed Pad Quad Flat Pack
文件大小: 117.34KB 共2页
简 介:QFP-ep
Exposed Pad Quad Flat Pack
7 x 7mm to 24 x 24mm body sizes 32 to 216 lead count Lead pitch range from 0.80mm to 0.40mm
FEATURES
Body Sizes: 7 x 7mm to 24 x 24mm Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep) Lead Counts: 32L to 216L Lead Pitch: 0.40mm to 0.80mm Wide range of open tool leadframe and die pad sizes available JEDEC standard compliant Lead-free and Green material sets available
DESCRIPTION
STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding. STATS ChipPAC’s QFP-ep family includes the Exposed Pad-Low Profile QFP (LQFP-ep) and the Exposed Pad-Thin QFP (TQFP-ep). These enhanced thermal packages are made possible by deep downset die pad leadframe design combined with well controlled low loop wirebonding and package warpage control during the molding process.
APPLICATIONS
ASIC DSP Gate Array Logic, Microprocessors/Controllers Multimedia, PC Chipsets, Others
www.statschippac.com
QFP-ep
Exposed Pad Quad Flat Pack
SPECIFICATIONS
Die Thickness Gold Wire Lead Finish Marking Packing Options 304-482m (12-19mils) range preferred 25/30m (1.0/1.2mils) diameter, 99.999% Au 85/15 Sn/Pb or Matte Tin Laser/ink JEDEC tray/tape and reel
RELIABILITY
Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test Liquid Thermal ……
