器件名称: MS3261R33ML
功能描述: MULTILAYER CHIP INDUCTOR
文件大小: 211.72KB 共6页
简 介:SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 1
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO. ABC'S ITEM NO.
MS3261□□□□ L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
C
I B
G
I
( PCB Pattern )
Unit : m/m C D 0.60 ±0.40 G 2.2 H 1.4 I 1.1
Series MS3261
A 3.20 ±0.20
B 1.60±0.20
1.10±0.20
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body ：Ferrite b ﹒Internal conductor： Silver or Ag / Pd c﹒Terminal： Cu/Sn d ﹒Remark： Products comply with RoHS' requirements
a
b
H c
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.： -40℃---- +105℃ b ﹒Operating temp.： -55℃ ---- +125℃ c﹒Terminal storength： F Type MS3261 d﹒Solderability： Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A F ( kgf ) 1.0 time ( sec ) 30 ±5
Temperature ( ℃ ) 250
50sec max.
Peak Temp： 260 ℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max.
Temperatu re Rising Area +4.0℃ / sec max. Preheat Area 150 ~ 200 ℃ / 60 ~ 120sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Coo ling Area -(1 .0 ~ 5.0)℃ / sec max.
Peak Temperature: 260℃ 230℃
200 150
70sec max.
100 50
0
50
100
150 Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 2
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO. ABC'S ITEM NO.
MS3261□□□□L□-□□□
Ⅴ﹒ELECTRICAL CHARACTERISTICS ：
DWG No. MS326147NML□ -□□□ MS326168NML□ -□□□ MS3261R10ML□ -□□□ MS3261R12ML□ -□□□ MS3261R15ML□ -□□□ MS3261R18ML□ -□□□ MS3261R22ML□ -□□□ MS3261R27ML□ -□□□ MS3261R33ML□ -□□□ MS3261R39ML□ -□□□ MS3261R47ML□……
