器件名称: MH10052N2D2
功能描述: MULTILAYER CHIP INDUCTOR
文件大小: 110.38KB 共6页
简 介:SPECIFICATION FOR APPROVAL
REF : PROD. NAME ABC'S DWG NO. PAGE: 1
MULTILAYER CHIP INDUCTOR
ABC'S ITEM NO.
MH1005□□□□2□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A A B B C D D : : : : 1.00±0.10 0.50±0.10 0.50±0.10 0.23±0.10 m/m m/m m/m m/m
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒FEATURES：
a﹒Monolithic structure ensuring high performance and reliability. b﹒High frequency applications up to 6GHz. c﹒Terminal：Ag/Cu/Ni/Sn d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒APPLICATIONS：
a﹒RF modules for telecommunication systems including GSM, PCS,DECT,WLAN,Bluetooth,etc.
Peak Temp：260 ℃ max. Max time above 230℃ ： 50sec max. Max time above 200℃ ： 70sec max.
C
Ⅴ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-55℃---- +125℃ b﹒Operating temp.：-55℃ ---- +125℃ c﹒Solderability：Preheat 150℃. 60 sec Solder：H63A Solder temp.：230±5℃ Flux：Rosin Dip time：4±1 sec
Temperature ( ℃ ) 250
Temperature Rising Area +4.0℃ / sec max.
Preheat Area 150 ~ 200 ℃ / 60 ~ 120sec
Reflow Area
Forced Cooling Area
+2.0 ~ 4.0℃ -(1.0 ~ 5.0)℃ / sec max. / sec max.
Peak Temperature: 260℃ 50sec max. 230℃
200 150
70sec max.
100 50
0
50
100
150 Time ( seconds )
200
250
AR-001A
SPECIFICATION FOR APPROVAL
REF : PROD. NAME ABC'S DWG NO. PAGE: 2
MULTILAYER CHIP INDUCTOR
ABC'S ITEM NO.
MH1005□□□□2□-□□□
Ⅵ﹒ELECTRICAL CHARACTERISITCS：
DWG No. MH10051N0D2 □-□□□ MH10051N2D2 □-□□□ MH10051N5D2 □-□□□ MH10051N8D2 □-□□□ MH10052N0D2 □-□□□ MH10052N2D2 □-□□□ MH10052N4D2 □-□□□ MH10052N7D2 □-□□□ MH10053N0D2 □-□□□ MH10053N3D2 □-□□□ MH10053N6D2 □-□□……
