器件名称: MH20121N2DL
功能描述: MULTILAYER CHIP INDUCTOR
文件大小: 106.69KB 共6页
简 介:REF : PROD. NAME
PAGE: 1
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO. ABC'S ITEM NO.
MH2012□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A A B B C D D : : : : 2.00±0.20 1.20±0.20 0.85±0.20 0.50±0.30 m/m m/m m/m m/m
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒FEATURES：
a﹒Monolithic structure ensuring high performance and reliability. b﹒High frequency applications up to 6GHz. c﹒Terminal：Ag/Cu/Ni/Sn d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒APPLICATIONS：
a﹒RF modules for telecommunication systems including GSM, PCS,DECT,WLAN,Bluetooth,etc.
Peak Temp：260 ℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max.
Temperature Rising Area +4.0℃ / sec max. Preheat Area 150 ~ 200℃ / 60 ~ 120sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Cooling Area -(1.0 ~ 5.0)℃ / sec max.
Peak Temperature: 260℃ 230℃
Ⅴ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-55℃---- +125℃ b﹒Operating temp.：-55℃ ---- +125℃ c﹒Solderability：Preheat 150℃. 60 sec Solder：H63A Solder temp.：230±5℃ Flux：Rosin Dip time：4±1 sec
Temperature ( ℃ ) 250 200 150
C
50sec max.
70sec max.
100 50
0
50
100
150 Time ( seconds )
200
250
AR-001A
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 2
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO. ABC'S ITEM NO.
MH2012□□□□L□-□□□
Ⅵ﹒ELECTRICAL CHARACTERISTICS ：
Inductance ( nH ) 1.2 ± 0.3 1.5 ± 0.3 1.8 ± 0.3 2.2 ± 0.3 2.7 ± 0.3 3.3 ± 0.3 3.9 ± 0.3 4.7 ± 0.3 5.6 ± 0.3 6.8 ± 5% 8.2 ± 5% 10.0 ± 5% 12.0 ± 5% 15.0 ± 5% 18.0 ± 5% 22.0 ± 5% 27.0 ± 5% 33.0 ± 5% 39.0 ± 5% 47.0 ± 5% 56.0 ± 5% 68.0 ± ……
