器件名称: MU1005300YL
功能描述: MULTILAYER CHIP BEAD
文件大小: 117.17KB 共6页
简 介:SPECIFICATION FOR APPROVAL
REF : PROD. NAME ABC'S DWG NO. PAGE: 1
MULTILAYER CHIP BEAD
ABC'S ITEM NO.
MU1005□□□□L□-□□□
Ⅰ﹒ CONFIGURATION & DIMENSIONS：
A
D
D
C
B
I
G PCB Pattern
I Unit : m/m
Series MU1005
A 1.00±0.10
B 0.50±0.10
C 0.50±0.10
D 0.20±0.10
G 0.4
H 0.4
H
I 0.5
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒ Body： Ferrite b﹒ Internal conductor：Silver or Ag / Pd c﹒ Terminal electrode：Ag/Ni/Sn d﹒ Remark： Products comply with RoHS' requirements
a
b
c
Ⅳ﹒GENERAL SPECIFICATION：
a﹒ Storage temp.： -40 ---- +105℃ b﹒ Operating temp.： -55 ---- +125℃ c﹒ Terminal strength： F Type MU1005 d﹒Solderability： Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A F ( kgf ) 0.3 Time ( sec )
Temperature ( ℃ ) 250
50s ec max.
Peak Temp ： 260 ℃ max. M ax tim e above 230℃ ： 50sec max. M ax tim e above 200℃ ： 70sec max.
Temperature Rising Area +4.0℃ / sec max. Preheat Area 150 ~ 200 ℃ / 60 ~ 120sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Cooling Area -(1.0 ~ 5.0)℃ / sec max.
P eak Temperature: 260℃ 230℃
30±5
200 150
70sec max.
100 50
0
50
100
150 Tim e ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 2
MULTILAYER CHIP BEAD
ABC'S DWG NO. ABC'S ITEM NO.
MU1005□□□□L □-□□□
Ⅴ﹒ELECTRICAL CHARACTERISITCS：
DWG No. MU1005300YL□-□□□ MU1005600YL□-□□□ MU1005121YL□-□□□ MU1005221YL□-□□□ MU1005301YL□-□□□ MU1005451YL□-□□□ MU1005601YL□-□□□ Impedance (Ω) At 100MHz 30.0±25 % 60.0±25 % 120.0±25 % 220.0±25……
