器件名称: MB2029300YL
功能描述: HIGH CURRENT MULTILAYER CHIP BEAD
文件大小: 219.93KB 共6页
简 介:SPECIFICATION FOR APPROVAL
REF : 20090527-A PROD. NAME PAGE: 1 ABC'S DWG NO. ABC'S ITEM NO. MB□□□□□□□□ L□-□□□
HIGH CURRENT MULTILAYER CHIP BEAD
A
Ⅰ﹒CONFIGURATION & DIMENSIONS：
D
D
I C
G
I
( PCB Pattern ) B Unit : m/m C 1.5±0.2 1.6±0.2 1.1±0.2 0.9±0.2 0.8±0.2 D 0.6 ±0.4 0.6 ±0.4 0.6 ±0.4 0.5 ±0.3 0.3 ±0.2 G 3.0 3.0 2.2 1.0 0.7 H 3.0 1.4 1.4 1.0 0.7 I 1.5 1.5 1.1 1.0 0.7
Series MB4532 MB4516 MB3261 MB2029 MB1608
A 4.5±0.2 4.5±0.2 3.2±0.2 2.0±0.2 1.6±0.2
B 3.2±0.2 1.6±0.2 1.6±0.2 1.2±0.2 0.8±0.2
Ⅱ﹒SCHEMATIC DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite b﹒Internal conductor：Silver or Ag / Pd c﹒Terminal：Ag/Ni/Sn d﹒Remark：Products comply with RoHS' requirements
a
b
c
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40℃ ---- +105℃ b﹒Operating temp.：-55℃ ---- +125℃ c﹒Terminal strength： F Type MB4532 MB4516 MB3261 MB2029 MB1608 d﹒Solderability： Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A F ( kgf ) 1.5 1.0 1.0 0.6 0.5 Time ( sec )
250 Peak Temp： 260 ℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max.
Temperature Rising Area +4.0℃ / sec max. Preheat Area 150 ~ 200 ℃ / 60 ~ 120 sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Cooling Area -(1.0 ~ 5.0)℃ / sec max.
Peak Temperature: 260℃ 50sec max. 230℃
30±5
Temperature ( ℃ ) 200 150
70sec max.
100 50
0
50
100
150 Time ( seconds )
200
H
250
SPECIFICATION FOR APPROVAL
REF : 20090527-A PROD. NAME PAGE: 2-1 ABC'S DWG NO. ABC'S ITEM NO. MB□□□□□□□□L□-□……
