器件名称: EK09
功能描述: EVALUATION KIT FOR TO-3 AND MO-127 PACKAGES
文件大小: 224.96KB 共4页
简 介:
INTRODUCTION
This kit provides a solid mechanical platform with good shielding and grounding to breadboard eight pin TO-3 packages or the MO-127 package with 0.060" pins. This kit is not intended as an alternate for kits dedicated to specic ampliers. See www. apexmicrotech.com for availability of dedicated kits. Construction will involve surface mounting and 3D techniques. Holes are provided to mount standard banana and BNC connectors for I/O. See the Apex Accessories Information data sheet for a selection of at-back heatsinks and thermal washers for these packages. Note that HS11 is compatible with EK09 and all three sockets can be used if desired. If the EK09 is to be used as an MO-127 platform only, HS18 rated at 1° C/W is a cost effective alternative to HS11 if internal power dissipation permits. Lower cost alternatives for two package TO-3 applications are HS02, HS01, and HS09. For single package TO-3 applications the HS13 is also suitable. The six chip capacitors provided can be used as the critical rst step in power supply bypass for dual supplies for all three sockets. These capacitors are rated at 200V.
ASSEMBLY
Let us dene the side of the top board with solder pads for each pin (roughly triangular on the TO-3 sockets) as the component side, where all the support components will determine circuit function and will be inside the nished box. The other side of this board is hereby dubbed the amplier side. Insert cage jacks from the amplier side and……
