器件名称: ETCSP
功能描述: the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
文件大小: 148.67KB 共2页
简 介:data sheet
Features:
LAMINATE
Up to 176 ball count 7-12 mm body size Thinnest CSP available at 0.5 mm max mounted height JEDEC Level 1 Reliability to 260 °C reflow temperature Conventional process flow with proven wirebond technology Standardized footprints at 0.5 mm pitch Package stacking potential of tested packages Two stacked die potential
etCSP
et CSP Package:
Amkor's et CSP package is the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. The et CSP package is constructed using conventional IC processing including standard wire bonding, molding and substrate infrastructure. The resulting package consists of one or two peripheral rows of 0.3 mm diameter solder balls to allow common SMT processing. There are many advantages as a direct result of the unique et CSP design. One key advantage is the 0.5 mm mounted height of the package, the result of solder ball diameter and thin core laminate substrate. Every other aspect of the package, die, wires and moldcap are within the dimensions of the substrate and solderballs. Another direct result of the et CSP design is the superior moisture resistance. Since die attach materials are not used to mount the die, there is reduced capability to trap moisture. Therefore, popcorn induced delamination is reduced. The et CSP package can also be designed with the capability of stacking completely tested packages, i.e., packa……
