AMKOR_datasheet_电子产品世界

公司名称:AMKOR

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ETCSP the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. AMKOR

LQFPPOWERQUAD4 LQFP PowerQuad AMKOR

CBGA From innovative designs and expanding package offerings, Amkor provides a AMKOR

FCCSP a flip chip solution in a CSP package format. AMKOR

MCMPBGA Innovative designs and expanding package offerings provide a platf AMKOR

PBGA Innovative designs and expanding package offerings provide a platf AMKOR

CABGA ChipArray AMKOR

CDIP Ceramic Dual-Inline Package AMKOR

CERDIP Ceramic Dual-Inline Package AMKOR

CERPAK Ceramic Pack AMKOR

CLGA Ceramic Land Grid Array Package AMKOR

CMCM Ceramic Multi-Chip Module Package AMKOR

CPGA Ceramic Pin Grid Array Package AMKOR

CQFP Ceramic Quad Flat Pack Package AMKOR

CSOIC Ceramic Small Outline Integrated Circuit Package AMKOR

CSPNL Wafer Level Packaging AMKOR

CSSOP Ceramic Shrink Small Outline Package AMKOR

CTBGA ChipArray AMKOR

CVBGA ChipArray AMKOR

FLATPACK Ceramic Flat Pack Package AMKOR

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