器件名称: CPGA
功能描述: Ceramic Pin Grid Array Package
文件大小: 533.21KB 共1页
简 介:data sheet
Ceramic Pin Grid Array Package (CPGA) Amkor Technology is committed to continuing to service this long established standard industry package. This thru-hole package consists of a co-fired ceramic base that has a matrix of pins brazed onto the bottom of the base. The lid for this package can be either ceramic "frit sealed" or metal "solder sealed". The package can be designed for either cavity up or cavity down configurations. This IC package technology allows application and design engineers to maximize the performance characteristics of semiconductors (silicon & GaAs). CPGAs are designed for low inductance, enhanced thermal operation and capability. Custom performance enhancements are available for significant improvements in electrical response demanded by advancing electronics. Applications: Semiconductor technologies find enhanced performance by using the integrated design features of the CPGA package. Microprocessors / controllers, ASICs, Gate Arrays, memory, DSPs and PC chip sets find the CPGA family to be an ideal package. Applications requiring improved thermal performance and high-speed performance such as desk PCs, laptop PC's, and other similar products benefit from the CPGA attributes.
Features:
CERAMIC
/
HERMETIC
CPGA
The CPGA offers a variety of features. From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production. Flexible pin counts Variety of body sizes 50 mil & 100 mil pin pitch Staggered……
