器件名称: CQFP
功能描述: Ceramic Quad Flat Pack Package
文件大小: 332.85KB 共1页
简 介:data sheet
Ceramic Quad Flat Pack Package (CQFP) Amkor Technology is continuing to service this established industry package. The Amkor Technology CQFP capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The CQFP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "gullwing" formed leadframe. The ceramic / LF / ceramic system is held together hermetically by glass. The frit lid is sealed/reflowed over the package cavity at temperatures between 400° - 460° Centigrade. Applications: Along with the other standard industry packages, the CQFP has a proven track record and is still being used by semiconductor technologies such as: Digital to Analog converters, Microwave, Logic, Memory, Microcontrollers, and Video controllers. Some end applications are: Military electronics, Commercial electronics, Automotive and Telecommunications.
Features:
CERAMIC
/
HERMETIC
CQFP
The CQFP offers a variety of features: Square package body 14-256 lead count, 25-50 mil lead pitch's Hermetic package High thermal conductive ceramic Solder Plate lead finish JEDEC standard compliant Wide selection of available cavity sizes to meet most die size needs Commercial or full Military flows
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TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
www.amkor.com
DS806 Rev Date: 08’02
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