器件名称: CSSOP
功能描述: Ceramic Shrink Small Outline Package
文件大小: 304.39KB 共1页
简 介:data sheet
Ceramic Shrink Small Outline Package (CSSOP) This is a ceramic version of the Plastic SSOP package. The CSSOP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "gullwing" formed leadframe. This package has leads extending from two sides of the package (dual). The ceramic / LF / ceramic system is held together hermetically by glass. The frit lid is sealed/reflowed over the package cavity at temperatures between 400° - 460° Centigrade. Applications: These packages enable end products (pagers, portable audio / video, disc drives, radio, RF devices / components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon/GaAs technologies are well addressed by Amkor's CSSOP product family.
Features:
CERAMIC
/
HERMETIC
CSSOP
The CSSOP offers a variety of features: 20 & 24 lead counts (Others available when tooled) 150 mil body size (Others available when tooled) Hermetic package High thermal conductive ceramic Matte Tin Plate lead finish JEDEC and EIAJ package outline standard compliant Wide selection of cavity sizes to meet most die size needs Commercial or full Military flows
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TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
www.amkor.com
DS808 Rev Date: 08’02
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