器件名称: CVBGA
功能描述: ChipArray
文件大小: 310.74KB 共2页
简 介:data sheet
Features:
LAMINATE
CABGA/CTBGA/CVBGA
Cutting edge technology and expanding package offerings provide a platform from prototype-to-production. Full, in-house design Square or rectangle packages available 4 mm to 21 mm body size available 8 to 449 ball counts 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available JEDEC MO-216 compliant for 0.8 mm and 1.0 mm ball pitch JEDEC MO-195 compliant for 0.5 mm & 0.65 mm ball pitch PB free and Green package available Daisy Chain packages available Short traces for excellent electrical inductance Low inductance (modeled data) 1.4nH (1.0 mm trace length) 4.1nH (5.0 mm trace length) Theta JA at 1.0 Watt and 0 airflow (°C/Watt) CABGA CTBGA CVBGA 8x8 37.28 36.45 37.52 10 x 10 19.86 29.04 26.7 11 x 11 29 N/A N/A 15 x 15 20.1 N/A N/A 19 x 19 17.04 N/A N/A Amkor assures reliable performance by continuously monitoring key indices: Moisture sensitivity JEDEC Level 2 @ 240 °C characterization JEDEC Level 3 @ 260 °C 85 °C/85% RH, 168 hours Temp/humidity 85 °C/85%, 1000 hours High temp storage 150 °C, 1000 hours HAST 130 °C/85% RH, 96 hours Temp cycle -55/+125 °C, 1000 cycles
ChipArray Packages: Amkor’s ChipArray packages are laminatebased Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes. (See table on back.) In addition to the standard core ChipArray package (CABGA), Amkor offer……
