器件名称: FLATPACK
功能描述: Ceramic Flat Pack Package
文件大小: 490.74KB 共1页
简 介:data sheet
Ceramic Flat Pack Package (FP) Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has leads brazed to either the top or bottom of the package. The lid for this package can be either ceramic "frit sealed" or metal "solder sealed". This package provides a hermetic environment for the IC inside. Applications: This IC package technology allows application and design engineers to maximize the performance characteristics of semiconductors (silicon, GaAs and S.A.W.). These packages enable end products (pagers, portable audio/video, disc drives, radio, IF & RF devices/components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon/GaAs/S.A.W. technologies are well addressed by the LLCC product family.
Features:
CERAMIC
/
HERMETIC
Flat Pack
The Flat Pack package offers a variety of features for the semiconductor IC industry and Amkor provides a platform from prototype-to-production: Flexible lead / pin counts Variety of body sizes Hermetic package Exceptional thermal and electrical performance by design Multi-layer, ground / power Cavity Up / Cavity down configurations Cavity package
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