器件名称: MCMPBGA
功能描述: Innovative designs and expanding package offerings provide a platf
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简 介:data sheet
Features:
LAMINATE
MCM-PBGA
Innovative designs and expanding package offerings provide a platform from prototype-to-production. Ball counts up to 1156 13.0 mm to 40.0 mm body sizes 1.00, 1.27 & 1.50 mm ball pitch available Perimeter, stagger and full ball arrays Special packaging for memory available 2, 4, or 6 layer construction, ground / power Full in-house design capability JEDEC MS-034 standard outlines MCM under high volume manufacturing in all sites Enhanced electrical performance, shorter signal paths and reduced package parasitics 2-8 active devices 200-600 wire bonds Passives can be added by utilizing the SMT equipment located in the SiP line Multi layer PCB, 0 air flow
Pkg Body Size PCB Layer Cu Thickness Theta JA (°C/W)
MCM-PBGA Packages:
The MCM-PBGA (Multi-Chip Module Plastic Ball Grid Array) by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA package provide the platform to mix semiconductor technologies such as analog, digital, bipolar, CMOS, ASIC, memory, etc., in a single IC package. The affordability of our MCM-PBGAs enable systems designers to realize their vision of new, advanced or improved applications. Our designs are optimized to use standard PBGA package outline tooling to save you costs and utilize a proven BGA infrastructure. Additionally, we work with you to produce the most efficient substrate circuit design that will enhance the ……
